AMD unveils 7nm data centre GPUs
New GPUs designed to support complex next-generation computing tasks
AMD has unveiled the new AMD Radeon Instinct MI60 and MI50 accelerators, the world's first 7nm data centre GPUs.
The graphics processors have been designed to meet next-generation computing requirements for intensive tasks such as HPC, cloud computing, deep learning and more. AMD said that the processors will support challenging tasks in areas such as large-scale simulations, climate change, computational biology, and disease prevention.
The AMD Radeon Instinct MI60 and MI50 accelerators feature flexible mixed-precision capabilities, powered by high-performance compute units that expand the types of workloads these accelerators can address, including a range of HPC and deep learning applications. The new accelerators were designed to efficiently process workloads such as rapidly training complex neural networks, delivering higher levels of floating-point performance, greater efficiencies and new features for data centre and departmental deployments.
The AMD Radeon Instinct MI60 and MI50 accelerators provide ultra-fast floating-point performance and hyper-fast HBM2 (second-generation High-Bandwidth Memory) with up to 1 TB/s memory bandwidth speeds. They are also the first GPUs capable of supporting next-generation PCIe 4.0 interconnect, which is up to 2X faster than other x86 CPU-to-GPU interconnect technologies, and feature AMD Infinity Fabric Link GPU interconnect technology that enables GPU-to-GPU communications that are up to 6X faster than PCIe Gen 3 interconnect speeds.
"Legacy GPU architectures limit IT managers from effectively addressing the constantly evolving demands of processing and analysing huge datasets for modern cloud data centre workloads," said David Wang, senior vice president of engineering, Radeon Technologies Group at AMD. "Combining world-class performance and a flexible architecture with a robust software platform and the industry's leading-edge ROCm open software ecosystem, the new AMD Radeon Instinct accelerators provide the critical components needed to solve the most difficult cloud computing challenges today and into the future."
AMD also announced a new version of the ROCm open software platform for accelerated computing that supports the architectural features of the new accelerators, including optimized deep learning operations (DLOPS) and the AMD Infinity Fabric Link GPU interconnect technology. Designed for scale, ROCm allows customers to deploy high-performance, energy-efficient heterogeneous computing systems in an open environment.
The AMD Radeon Instinct MI60 accelerator is expected to ship to data centre customers by the end of 2018. The AMD Radeon Instinct MI50 accelerator is expected to begin shipping to data centre customers by the end of Q1 2019. The ROCm 2.0 open software platform is expected to be available by the end of 2018.
AMD also gave details of its upcoming Zen 2 high-performance x86 CPU processor core that is the result of a revolutionary modular design methodology. This modular system design uses an enhanced version of AMD Infinity Fabric interconnect to link separate pieces of silicon (chiplets) within a single processor package. The multi-chip processor uses 7nm process technology for the Zen 2 CPU cores that benefit from the advanced process technology, while leveraging a mature 14nm process technology for the input/output portion of the chip. The result is much higher performance – more CPU cores at the same power, and more cost-effective manufacture than traditional monolithic chip designs.
Combining this breakthrough design methodology with the benefits of TSMC’s leading-edge 7nm process technology, AMD says that Zen 2 delivers significant performance, power consumption and density generational improvements that can help reduce data centre operating costs, carbon footprint and cooling requirements.