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Huawei, Intel sign MoU

Combined clout will allow new market offerings, say spokesmen

Partnership is to include joint engineering projects for server, storage, data centre and cloud.
Partnership is to include joint engineering projects for server, storage, data centre and cloud.

Solutions provider Huawei has signed a Memorandum of Understanding (MoU) with Intel Corporation to bring collaborative offerings to market.

Announced during the Huawei Cloud Congress 2012, the partnership is to include joint engineering projects to build products and solutions for server, storage, data centre and cloud computing. The arrangement will also allow combined ventures in China and other countries.

Another aim of the MoU is to split market development efforts. The pooled resources of Intel and Huawei are expected to allow the shortening of product development cycles through solution alignment.

"Intel leads in computing innovation, and builds advanced platforms for server, cloud computing, storage and data center solutions," said Ian Yang, Intel corporate vice president and China president.

"The strategic MoU between Intel and Huawei will bring the co-operation to a new level. The key advantage for both companies is the ability to bring new innovative product and usage models to market."

"Huawei has strong capability in server, storage, data center and cloud computing," said Zheng Yelai, president of Huawei IT product line.

"We have had an excellent collaboration over the past ten years with Intel. The strategic global co-operation MoU on IT will only help to strengthen the Huawei and Intel relationship, and allow us both to innovate around customer demand - providing more efficient, more valuable ICT solutions to our customers."