Intel and Siemens to work together on VoIP solutions

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By  Published  September 29, 2006

Chip maker Intel and communications giant Siemens are to collaborate on voice over internet protocol (VoIP), the companies announced last month in a joint statement.

The two firms announced that they have forged an agreement to work together to create open unified communications solutions based on VoIP for customers in segments that will include telecommunications service providers, financial services and digital healthcare.

The collaboration will start with the companies jointly funding and conducting research focused on secure wireless networks and real-time open unified communications.

“Intel’s experience as the leading provider of silicon technology to the enterprise market worldwide and established track record of industry collaboration puts it in a great position to shape the enterprise of the future,” Gordon Graylish, Intel vice president of the sales and marketing group for Europe, Middle East and Africa (EMEA), said in a statement.

“As a result of this collaboration, enterprise customers will be able to avail themselves of unified communications based on the industry’s highest performance and most cost-effective architecture.”

Siemens also underlined its commitment to the project and said it expected to see significant growth in the open unified communications market.

“Siemens has a strong commitment to this joint development effort and to an ongoing collaboration with Intel,” commented Thomas Zimmermann, president, Enterprise Systems at Siemens.

“Growth potential for the open unified communications market is significant. Our own customer base for the HiPath 8000 solution hasmore than doubled since the first quarter of the year, and Siemens is adding a new HiPath 8000 customer nearly every week,” he added.

Siemens is hoping to sell off its Enterprise Systems division, which specialises in building telecoms systems for large corporations, by the end of the month.

The companies said that they will present the findings of their research to selected customers at an Intel lab in the US, which is scheduled to take place by the fourth quarter of 2006.

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