Toshiba unveils 64-Layer, 3D flash memory NVMe SSD

New XG5 Series SSDs with BiCS FLASH deliver up to 1TB in compact form factor targeting mobile PCs

Tags: StorageToshiba CorporationUnited Arab Emirates
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Toshiba unveils 64-Layer, 3D flash memory NVMe SSD XG5 series suited to a wide range of applications including ultra-mobile PC.
By  David Ndichu Published  May 31, 2017

Toshiba has launched the XG5 series, a new line of NVM Express (NVMe) SSDs integrating 64-layer, 3D flash memories, offering up to 1TB capacity in a compact M.23 form factor.

Starting today, OEM customers will have access to limited quantities of qualification samples with shipments gradually increasing in the second half of 2017.

As the third generation of the Toshiba XG Series, XG5 SSDs feature the latest 3-bit-per-cell TLC (triple-level cell) BiCS FLASH and utilise PCI EXPRESS (PCIe) Gen3 x 4 lanes and NVMe Revision 1.2.1 to deliver high performance up to 3000 MB/s of sequential read and 2100 MB/s of sequential write.

Compared to 6Gbit/s SATA storage, the XG5 Series is up to 5.4 times faster on sequential read performance and up to 3.8 times faster on sequential write performance with a maximum interface bandwidth of 32 GT/s. Additionally, XG5’s feature-set also includes an SLC cache for enhanced performance to accelerate burst type workloads, such as those experienced routinely on Windows-based PCs, as well as improved standby power consumption reduced by over 50% to less than 3mW. The features make these SSDs ideal for high performance mobile computing.

XG5 Series SSDs will be available in three capacities, 256GB, 512GB and 1024GB, all on a single-sided M.2 2280 form factor. Self-encrypting drive (SED) models supporting TCG Opal Version 2.01 will also be offered, making the XG5 series well suited to a wide range of applications including ultra-mobile PCs that prioritise performance and business applications requiring security.

The XG5 series SSDs will be showcased at COMPUTEX TAIPEI 2017 in Taipei, Taiwan, from May 30 to June 3.

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