TP-Link’s Neffos smartphone brand exhibits at CES 2017

TP-Link showcases its X1 and the X1 Max at the Consumer Electronics Show 2017

Tags: TP-LINK (www.tp-link.com/en/‎)
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TP-Link’s Neffos smartphone brand exhibits at CES 2017 The company showcased its latest offerings, the X1 and the X1 Max, which combined quality design and craftsmanship with high performance.
By  Aasha Bodhani Published  January 8, 2017

For the first time, TP-Link's smartphone brand Neffos exhibited at the Consumer Electronics Show 2017 in Las Vegas.

The company showcased its latest offerings, the X1 and the X1 Max, which combined quality design and craftsmanship with high performance.

The devices are built with high-quality materials to provide an enhanced user experience, whilst also featuring a microphone hole, camera and fingerprint sensor. The sensor unlocks the device in 0.2 seconds by relying on sophisticated algorithms, meaning the more the user unlocks the device the more accurate it becomes over time.

The frame of the device measure 7.85mm thick, however its visual thickness is 2.75mm, plus its IPS display is 5-inches for the X1 and 5.5-inches for the X1 Max. The Neffos X1 and X1 Max are also ideal for playing graphics-rich games and watching TV shows and movies on the go.

Both models are equipped with a rear camera backed by a 13-megapixel Sony IMX258 sensor with dual-tone flash, 5-element lens, backside illumination, and fast phase-detection auto-focus of just 0.2 seconds.

The forward-facing camera is 5 megapixels and sports a wide-angle lens and the real-time Beautify mode is built into the camera software so that users are just one tap away from taking the perfect selfie.

Inside, the Neffos X1 and X1 Max are powered by an octa-core chip from MediaTek, paired with as much as 4GB of RAM and 64GB of internal memory with expandable storage of up to 128GB. Furthermore, the devices run on Android 6.0 Marshmallow and the X1 Max includes a high-capacity 3,000mAh battery.

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