Samsung mass produces 14-Nanometer processor
Exynos 7570 is the first Exynos processor to fully integrate a Cat 4 LTE 2CA modem
Samsung Electronics Co, Ltd, a maker of advanced semiconductor technology, has announced that it has commenced mass production of Exynos 7 Quad 7570, the company's newest mobile application processor (AP) built on 14-nanometer (nm) process technology for the budget smartphone market as well as other IoT devices.
Samsung said being the first mobile AP designed with the advanced process node, Exynos 7570 is the first Exynos processor to fully integrate a Cat 4 LTE 2CA modem and connectivity solutions including WiFi, Bluetooth, frequency modulation (FM) and global navigation satellite system (GNSS) in one chip.
"With Exynos 7570, more consumers will be able to experience the performance benefits of the advanced 14nm FinFET process in affordable devices," said Ben K. Hur, vice president of System LSI Marketing, Samsung Electronics. "By successfully integrating various connectivity solutions, Samsung is strengthening its competitiveness in the single chip market."
Last year, Samsung adopted advanced 14nm FinFET technology for its premium processors and has since expanded the adoption to other segments, bringing premium features to more affordable smart devices.
As part of such efforts, the company said Exynos 7570 is the first with 14nm FinFET, making it highly power-efficient while enabling outstanding performance.
Exynos 7570, with four Cortex-A53 cores in 14nm, delivers 70% improvements in CPU performance and 30% improvement in power efficiency when compared to its predecessor built on 28nm. The new Exynos also offers a fully connected mobile experience by integrating a Cat. 4 LTE 2CA modem and various connectivity solutions, such as WiFi, Bluetooth, FM radio and GNSS.
According to Samsung with design optimisation and feature consolidation for components such as power management IC (PMICs) and RF (radio frequency) functionalities, Exynos 7570 reduces the total chipset size by up to 20%, giving manufacturers better ability to craft slimmer smartphones.