Global Foundries shows off new tech

The 2009 Symposium on VLSI Technology in Kyoto, Japan was the stage Global Foundries used to demonstrate its new fabrication technology.

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By  Jason Saundalkar Published  June 17, 2009

The 2009 Symposium on VLSI Technology in Kyoto, Japan was the stage Global Foundries used to demonstrate its new fabrication technology.

The technique allows the equivalent oxide thickness (EOT) in a high-k metal gate (HKMG) transistor to be shrunk down to beyond 22nm node size. The firm claims it’s able to do this while maintaining overall performance. Other fabrication firms have apparently succeeded in reducing the EOT to similar levels though this was at the expense of performance.

Global Foundries claims shrinking down to smaller node sizes will eventually allow for processors that offer better performance and lower power consumption than today’s models. A 32nm wafer was shown at Computex 2009, which is held annually in Taiwan.

The company says its achievement shows that its fabrication plant is on track to introducing HKMG ahead of its competitors, including TSMC, as far as 32nm nodes are concerned. It also claims its work so far proves that it is on the road to reaching 22nm production and beyond.

Global Foundries is a processor production foundry that chip firm AMD spun-off in order to downsize itself while maintaining the ability to control production methods. Existing processors from AMD and Intel are created using a 45nm fabrication process.

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