Intel completes design for WiMax connection

Mobile baseband chip to push forward adoption

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By  Published  December 16, 2006

Intel is hoping to push forward WiMax adoption by developing technology that helps to make better use of space within mobile devices.

The chip giant this month said it has completed the design work on its first mobile WiMax baseband chip, which along with its previously-announced single chip multi-band WiMax/Wi-Fi radio technology, creates a complete chipset, the Intel WiMax Connection 2300.

The completed chipset brings Intel closer to its goal of an “always best connected” experience for mobile internet users, the firm said.

The better integration that the Connection chipset provides also means that manufacturers can maximise usable space in mobile devices, while delivering better connectivity.

The Intel WiMax Connection 2300 chipset design was demonstrated during executive vice president and chief sales and marketing officer Sean Maloney’s keynote at the 3G World Congress and Mobility Marketplace in Hong Kong this month.

“Intel continues to drive innovation in mobile broadband access by eliminating the seams that prevent ubiquitous wireless connectivity,” said Maloney. “The Intel WiMax Connection 2300 will help speed the deployment of mobile WiMax, and accelerate the availability of a new wave of personal broadband laptops and mobile devices that deliver the real internet.”

With global frequency support for standards-based Wi-Fi and WiMax, scalable channel bandwidth, and high-performance multiple-antennas, the Intel Wi-Max Connection 2300 will help bring about mobile communications and rich content across supported networks anywhere in the world, the firm claimed.

For the first time, Intel has incorporated multiple input/multiple output (MIMO) functionality into the baseband chip, to enhance the signal quality and throughput of wireless bandwidth. The baseband chip also employs the same software for Intel’s WiMax and Wi-Fi solutions to help ensure unified management for connectivity.

Intel now plans to focus on validating and testing the product, with plans to sample both card and module forms in 2007.

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