Infineon unveils 65nm mobile chip

German-based Infineon Technologies has unveiled a 65-nanometre mobile phone chip that boasts 30 million transistors within a wafer space of 33 square millimetres.

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By  Cleona Godinho Published  May 14, 2006

German-based Infineon Technologies has unveiled a 65-nanometre mobile phone chip that boasts 30 million transistors within a wafer space of 33 square millimetres. According to the firm, the new chip features high performance at low power consumption, which translates into quicker application response times, faster downloads and extended battery life. The firm also reckons that the number of available mobile phone functions will increase ‘while the chip’s footprint decreases’. Infineon unveiled the first chip sample using 65-nanmometer technology this past February. 65-nanmometer refers to the size of each transistor, which is etched on the surface of the chip. The chip was built as part of a research and development alliance with IBM, Chartered and Samsung. Infineon has revealed that the new mobile chips will go into mass production in the next few months and will be ready for distribution by the end of this year.

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