Chip making (without the fat)

Intel has unveiled the technology breakthroughs behind its latest chips, and how this will save end-users money.

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By  Graham Stacey Published  September 11, 2002

Intel’s new 90-nanometre (nm) process incorporates the most advanced semiconductor manufacturing process in the industry, combining high-performance, low-power transistors, strained silicon, high-speed copper interconnects and a new low-k dielectric material. This is the first time all of these technologies have been used in a single manufacturing process.

Dr Sunlin Chou, senior vice president and general manager of Intel's Technology and Manufacturing Group, said: "This combination will allow Intel to make better products and reduce manufacturing costs."
For more than a decade, Intel has been introducing a new process generation every two years. The 90 nm process is the next generation after the 0.13 micron process, which Intel is using today to make the bulk of its microprocessors."

In February Intel used the 90 nm process to make the world's highest capacity SRAM chips at 52 megabits - capable of storing 52 million individual bits of information.

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