VIA release new retail packaging for C3 processor

VIA has released a new boxed retail bundle for global channel partners for its VIA C3 processor

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By  Mark Sutton Published  July 11, 2001

VIA Technologies has announced the launch of new packaging for its C3 processor. The processor, which is available in speeds up to 800MHz, is packaged in a retail boxed set with a ball-bearing fan and heatsink, as well as multi-lingual manual and three year warranty.

Aimed at channel partners, the retail set is factory-sealed to guarantee authenticity of the chip. VIA C3 is fully socket 370 compatible, and is built using 0.13 and 0.15 micron technology, to create the world’s smallest x86 processor die size of just 52mm. The small size optimises power consumption and chip cooling. The chip also features 100/133MHz front side bus, MMX and 3Dnow! Instructions and up to 192kb of full speed cache.

"The VIA C3™ processor retail box set provides a convenient and attractive all-in-one package for distributors, resellers, and system integrators building competitively priced Value PC systems." commented Richard Brown, Director of Marketing for VIA Technologies, Inc. "It is available in volume today.”

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