Via releases E-Series processor

Via Technologies has launched its C3 E-series processor aiming for the computing, communications, multimedia, and embedded device applications sectors of the market.

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By  Michelle Sturman Published  June 10, 2001

VIA Technologies has released its latest processor, aimed at the digital set top box, point of sale, embedded multimedia, and data communications markets.

The VIA C3 E-Series processor features an EBGA (Enhanced Ball Grid Array) package with ultra low power consumption and highly efficient heat dissipation properties.

The C3 is compatible with the standard PGA version, and leverages its small die size and architectural design to deliver power consumption to below one watt when running in optimised low voltage mode. Its heat dissipation properties mean that the processor doesn’t require active cooling, allowing ample room for when developing fanless, space saving systems in small form factors.

"The VIA C3Ô E-Series processor provides our customers with a highly affordable, low power processor solution for building fully integrated 'system on a motherboard' platforms," says Richard Brown, director of marketing for VIA Technologies.

"It opens up exciting new opportunities for developing a new wave of innovative devices for a broad spectrum of computing, communications, multimedia, and embedded applications."

The processor is available at speeds of up to 733MHz, and comes with up to 192KB full-speed Level 1 and Level 2 cache as well as support for a 100/133MHz Front Side Bus.

The processor can be integrated onto industry standard Socket 370 motherboard form factors such as Micro ATX, Flex ATX, and ITX.

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